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LiDAR and Teralink Lens
InGaAs Infrared Detectors
Optical Interconnects

LiDAR

LiDAR sensors

SEI's wafer foundries, wafer growth, and device fabrication of InP and GaAs based products deliver unique advantages to customer-specific high-performance LiDAR sensors. InGaAs PIN photodiodes and APD sensors that are multichannel 1-dimensional or 2-dimensional arrays can be packaged with commercially available or customer-provided electronics.

LiDAR lasers

SEI's capabilities also provide advantages in the development of customized high-performance LiDAR lasers, such as InP and GaAs based lasers from 850 nm to 1550 nm that are ultra-fast and high power.

Teralink™

Teralink is a transparent and solder reflow heat-resistant grade lens made for optical components used in SMT applications. Teralink is a thermoplastic material that is cross-linked by irradiating electron beams onto molded components. Lenses are custom designed to meet customer requirements, and mass produced by injection molding manufacturing.

Features

Teralink is highly transparent, and designed for wavelengths of 650 nm or longer
Two-color molding is possible, reducing the lens assembly cost

Applications

SMT (surface mount technology) related products

Infrared Image Sensors: eSWIR, MWIR, LWIR

T2SL eSWIR sensors

Type II Superlattice (T2SL) structure based on SEI wafer foundries, wafer growth, and device fabrication. The detectors are hybridized and packaged into a camera-ready interface. eSWIR has an extended range sensitivity from 1.0 to 2.5 μm, low dark current, high frame rate, and stable operation. The sensor is ideal for hyperspectral imaging applications.

Features

Wavelength from 1.0 to 2.5 μm
Low dark current
GVGA & VGA available
4-stage TE-cooled

T2SL MWIR/VLWIR sensors

Great progress has been made in the development of MWIR/VLWIR image sensors. Expected applications include Earth observation from aircraft and satellites.

Quantum Cascade Lasers (QCL)

DFB lasers based on SEI wafer foundries, water growth, and device fabrication. Available with wavelength sensitivity in the 7 μm and 5 μm ranges. Suitable for real-time gas detection in industrial, environmental, and medical applications. QCL lasers collate in continuous wave (CW), single-mode, and up to 60°.

Features

Smallest hermetic CAN package
Stable CW operation at high temperatures
High CW output power (>30 mW at 20°C)
Low power consumption (˜2 W)
High sensitivity for sensing applications (1.3 ppb for CH)
New model: 5.2 μm for NOx is available

Co-Packaged Optics (CPO)

SEI is a world leader in fiber optic cables and silicon photonics interconnects. We are currently working with customers to develop next-generation fiber optic interconnects that will enable high density, temperature resistant, easy to clean, plug-in compatible solutions for co-packaged optics.

FlexBeamGuidE™

Low profile fiber array for silicon photonics. Guaranteed low-loss coupling to the integrated photonic circuit. Low-profile design fits into QSFP-DD and QSFP28 modules or custom on-board optics.

FlexBeamGuidE is custom designed to meet customer requirements with high-volume manufacturing.

MUX/DEMUX using PLC or TFF based technology can also be added to the FlexBeamGuidE for CWDM and FR4 solutions.

Multi-Core Fiber (MCF)

MCF will enable next-generation ultra-high-density optical communication systems. In the same size standard fiber, MCF can deliver a minimum of 4X the amount of bandwidth for single mode optical fibers. Use cases include silicon photonics-based on-board or co-packaged optics, ultra-high-density switch/rack, data center fiber routing, and submarine optical communication systems.

AirMT™

A non-contact multi-fiber interconnect that offers easy cleaning, low insertion loss, and low mating force. Ideal for on-board, co-packaged and back-plane interconnects, AirMT will enable ultra-high dense ganged fiber optic connectors. The AirMT has 1/3 lower mating force than ordinary MPO connectors, single mode insertion loss of <0.5 dB and return loss >55 dB. The air-gap interface is extremely durable and can withstand >300 times mate/demate before cleaning.

Features

Easy cleaning
High durability
Low insertion loss
No epoxy in the beam
Low mating force
Cost effective

Applications

Data center switches
Harsh enviroments
Integrated on-board optics
5G base stations