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FPC (Flexible Printed Circuits) Product

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High Density Multi-layer FPC

High Density Multi-layer FPC

 Sumitomo Electric provides high density and rigidized multi-layer FPC which are critical for achieving the driving forces in functional density and size reduction to support current product packaging needs.

  We are also able to provide fully assembled interconnects, allowing for fully functional and tested interconnect sub-components.

  We recommend that design matters be discussed as soon as possible with our engineering or technical sales staff.

 
Example of Structure of 4 Layer Printed Wiring Board

Component Mounted FPC

Component Mounted FPC

The use of FPC product technologies have been widely expanded due to functional component assembly and various connection technologies.

  With our broad range of experience, products and capabilities, we are able to provide fully integrated FPC assembly solutions.

FPC Insulated with Liquid Polyimide (Non-Halogen Type)

 
FPC Insulated with Liquid Polyimide

 Our development of high density interconnect products not only takes into consideration capability performance but also environmental conditions for various market segments. The development of liquid polyimide dielectric provides for achievement in high functional density but also meets future objectives for environmental industry standards.

  Sumitomo Electric product development has created characteristics for excellent process control, as well as flexibility and dielectric performance.

  The ability for us to create a halogen free material composite results in our capabilities to meet standard UL V-0 requirements.

  Product development has provided for the application of this liquid polyimde dielectric technology in screened or photo-imageable material forms based on application needs.

 
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