September 5, 2018 Welcome to our booth #200 in ECOC2018
We are showcasing the next-generation optical interconnect solution for on-board-optics in ECOC2018 that takes place on 24-26 Sept. This year's concept is the ultra-high-density, space-efficient & freely customizable cabling, that definitely contributes to your developing of on-board-optics. Sumitomo's edged technologies such as fiber coupling technology for silicon photonics, dust insensitive connector and multi-core fiber can be seen there. In addition, you could discuss details with our engineers in our private meeting room.