Guideline for Handling of DI-BSCCO

Home > Specifications > Guideline for Handling of DI-BSCCO

Guideline for Handling of DI-BSCCO

Handling

  • Do not bend the wire below the critical diameter.
  • Do not pull the wire beyond the critical tension.
  • Take care of the critical stress when bending and pulling the wire at the same time.

Storage

  • Keep the wire in a dry and clean condition.
  • Keep away from water.
  • Do not expose the wire to the corrosive atmosphere.
  • The spool of the wire must not be laid down to avoid the distortion.
  • Do not rest heavy objects on the spool and the wire.
  • Comply with local regulation when disposal.

Soldering

  • The surface of the wire to be soldered must be cleaned.
  • Use a flux and solder at a recommended temperature of the solder, at the same time do not exceed the maximum temperature.
  • Use an adequate solder to prevent cold brightness (for all DI-BSCCO types) and silver leaching (for bare wires, Type H, G).

Type H, G

Type HT

Maximum Temp. (degree Celsius)

250

200

Splice

A longer overlap length will result in a smaller splice resistance. However, a shorter overlap length will result in a better stiffness at the splice point. The splice structure (splice length 20mm) below is recommended as one example by the balance between the splice resistance and the stiffness at the splice point.

Type H

Type HT - SS

Type HT - CA

Recommended Flux

KOKI*** : JS-E-15X

Thickness of Splice (mm)

≦ 0.53

≦ 0.69

≦ 0.81

Width of Splice (mm)

≦ 4.6

≦ 4.8

≦ 4.8

Resistance (nΩ )

≦ 40

≦ 950

≦ 90

Critical Wire Tension** @R.T. (N)

≧ 80

≧ 230

≧ 280

Critical Double Bending Diameter** @R.T. (mm)

180

140

140

** 95% Ic Retention  *** http://www.ko-ki.co.jp/

Curing

Maximum allowable temperature for the resin impregnation will depend on the configuration of the coil, but the wire itself is preferable to be maintained below 150 degree Celsius.

Page Top