As 4G/LTE*4 smartphones spread rapidly, the capacity demands of the backbone network keeps increasing. E-band wireless backhaul link is recognized as not only a cost effective solution but also a relatively robust infrastructure in case of potential damage.
E-band WLCSP MMICs can be directly mounted on the PCB. Bonding wire free assembly process enables repeatable and stable performance and high manufacturing yield especially in millimeter wave frequency. Surface mountable WLCSP MMICs reduce mounting space by a factor of one-third. Downsizing of the amplifier contributes to a large cost reduction as well.
These products were designed in multiple models of 1st tier communication equipment manufacturers.
Microwave of frequency 60-90GHz, which is mainly used for short-distance and large-volume data communication.
*2 Wafer Level Chip Scale Package (WLCSP) with Surface Mount Technology (SMT)
*3 Monolithic Microwave IC (MMIC):
Plural elements, such as transistors and diodes, are integrated on a semiconductor substrate.
*4 Long Term Evolution (LTE):
The Standard of the Mobile Communications