Sumitomo Electric offers the total solution for optical interconnects at Board-level, Chip-level and Co-packaged Optics. Our innovative technologies such as dust proof connectors, silicon photonic IC couplers and ultra high density fibers can solve your product challenges.
Let's drop by our booth #200 in Hall 3 at ECOC2018 at Roma on Sep 24-26. You can discover our low loss and space-saving optical interconnect technologies,like coupler to PIC, dust insensitive connector, extremely small connector, multi-core fiber. SEI will have actual products' showcased and engineers to support technical discussions.